Metal Mask "E-SPEC" (Additive Specification)
Responding with short delivery times, low costs, and high quality! Supporting the fine fields of high-density metal masks.
Our unique additive processing technology supports the fine fields of high-density metal masks. We respond to requests for various types of metal masks, primarily for SMT-related applications, including bump formation masks, COB-compatible masks, fine masks for deposition, and thin plate jigs. Please consult us for special specifications. We will accommodate with short lead times, low costs, and high quality. 【Specifications】 ■ Processing method: Active method ■ Material: Ni (Nickel) Hv370 ■ Taper amount: Within 7% of plate thickness ■ Maximum processing area: 500mm x 600mm ■ Processing plate thickness: 0.03mm to 0.15mm ■ Plate thickness accuracy: Within 10% of plate thickness ■ Shape accuracy: ±10μm *For more details, please refer to the PDF document or feel free to contact us.
- Company:ピーワン
- Price:Other